EMEA 2021 Success Stories – STMicroelectronics’ AI Sensing Platform for early earthquake detection



Success Stories – Projects relevant to tinyML
STMicroelectronics’ AI Sensing Platform for early earthquake detection
Danilo PAU, Technical Director, IEEE and ST Fellow, STMicroelectronics Italia

Earthquake detection and warning systems are crucial to ensure the timely evacuation of local populations and to avoid human tragedies.
The Use Case 3 (UC3) in SEMIoTICS aims to provide an innovative technology for distributed Artificial Intelligence, allowing low-power IoT field devices to perform data processing at the edge, and to address a wide range of applications, including earthquake detection. Based on STMicroelectronics’s AI Sensing platform, the UC3 system enables highly scalable distributed intelligence, implementing the highly non-linear approximation capabilities of Artificial Neural Networks, statistical analysis, and distributed computation, thereby enabling increased system scalability, safety, and robustness.

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